T3 Temper Anodizing Aluminum Heat Sinks For Semiconductor Cooling

Blue Aluminum Anodizing Heat Sinks Wide Water Cooling Head Plate CPU Semiconductor Cooling Sheet

Description:

Product name: water cooling head, water cooling plate.

Material thickness: primary color water cooling head GB 6063A, thickness of 11.5mm ±0.5Blue oxide water cooling head national standard 6063A, thickness 12MM±0.5Copper water cooling head contact surface pure copper, water nozzle brass, thickness of 9.5mm ±0.5 nozzle

Specification: aluminum water cooling head maximum diameter 9.5mm (suitable for the store 7-8mm inner diameter pipe)Maximum outer diameter of copper water cooling head is 8.5mm (suitable for the store's 7MM inner diameter water pipe)

Heat dissipation effect:Material comparison - copper thermal conductivity (401W/mk) is greater than 6063A aluminum thermal conductivity (201W/mk) copper heat dissipation effect is good.Channel Contrast - Finned channels are denser than M-shaped channels and carry away heat more easily.

Therefore, finned channels are superior to M-shaped channels

Packing and delivery

Packaging Details

We have the package advantage:
1) The internal blister tray or pearl wool;
2) external carton packaging.

Delivery Time

1) Sample in 3 workdays after payment.

2) Mass production after payment 20 days.

Welcome to send us the detailed drawings.

Anodizing Aluminum Heat Sinks

T3 Temper Aluminum Heat Sinks

semiconductor cooling anodized aluminum heat sink

T3 Temper Anodizing Aluminum Heat Sinks For Semiconductor Cooling Images